The Inspectis Microscope BGA Inspection System ProX (BGA-ProX) is a premium, industrial-grade optical inspection workstation designed for detailed analysis of hidden solder joints on BGA, µBGA, CSP, CGA, FipChip, and SMD components. Built around a 5.0 MP USB3.0 digital camera with high-power LED illumination and advanced optics, the ProX system delivers superior image quality and flexible inspection control for quality assurance, manufacturing verification, and laboratory workflows.

Equipped with the Inspectis BGA ProX software suite, this system offers enhanced inspection functionality — including live image overlays, comparison tools, focus stacking, measurement, annotation, and reporting features. It also includes precision mechanical stages, ESD protection, a robust stand, and a complete computing environment with a 27″ UHD/4K monitor, making this solution ideal for demanding electronics inspection and documentation applications.

Specifications

• Part Number / SKU: BGA-ProX 

• Side-View BGA Lens:

  • On-screen magnification ~ 25× – 200× on 24″ monitor

  • Working distance ~ 0.5 – 25 mm 

  • High-power white LED microprism illumination

  • Probe footprint ~ 0.85 × 6.6 mm on PCB (≈ 1 mm free area required)

• Top-View Lens (8×–80×):

  • On-screen magnification ~ 8× – 80× 

  • Working distance ~ 10 – 150 mm 

  • LED ring illumination with holographic diffuser

• Integrated Digital Camera:

  • 1/2.5″ CMOS sensor, 2592 × 1944 (5 MP) 

  • USB3.0/USB3.1 Gen 1 interface (compatible with USB2.0)

  • Video modes up to Full HD 1080p @ 30 fps 

  • Camera controls: exposure, white balance, contrast, brightness, frame stacking, HDR, flip, and more 

  • Preset/recall magnifications and calibration recall 

• Software: Inspectis BGA ProX — advanced analysis, overlays, measurement, focus stacking, reporting, and documentation tools 

• Illumination:

  • Incident LED light

  • Micro-prism background LED

  • Fiber-optics background LED brush light

  • Electronic intensity control 

• Stand: Large antistatic base stand with coarse/fine focus, ±90° pivot, and soft-touch probe protection 

• Stage: Precision 50 × 50 mm XY stage with micrometer drives and antistatic protection 

• Environmental/Protection: ESD protection with ground (GND) connection on stand and stage 

• System Size & Weight: ~470 × 350 × 385 mm / ~14 kg

• Operating Conditions: −20 °C to +60 °C, 20 – 95 % RH, non-condensing

• Computer & Monitor: Included desktop and 27″ UHD/4K monitor (3840 × 2160)

• Carrying Case: Aluminum protective case included

• Manufactured: Sweden

• Return Policy: This item is not returnable

Features & Benefits

• High-Precision BGA Inspection: Clear imaging of hidden solder joints down to ~40 µm stand-off with advanced optical design and LED lighting. 

• Advanced ProX Software: Tools for image overlays, comparison, focus stacking, measurement, annotations, and automated reporting — ideal for detailed analysis and documentation. 

• Dual-Lens Flexibility: Combines side-view BGA optics with top-view varifocal capability, expanding inspection reach for both underside and surface features. 

• Precision Mechanical Stage: 50 × 50 mm XY movement ensures repeatable positioning for multi-area scanning and defect analysis. 

• ESD Safe Design: Grounded antistatic stand and stage support sensitive electronics environments. 

• Turnkey System: Complete package with computing, software, monitor, and protective case — ready for inspection right out of the box.